Thermal Characterization and Simulation of Integrated Microcoolers Formed by Anisotropic Etching
The thermal management of semiconductor devices (high performance FPGAs) is still an emerging field as the dissipation per area grows with the scaling. Most designers who are aware of the thermal behaviours, know that new, cheaper and more efficient methods are required to keep the temperature of electronic systems at bay. In this paper we present an approach to create an integrated microcooler device which can be capable of controlling the temperature of integrated devices cheaply and efficiently. The approach is based on a cheap wet etching process instead of reactive ion etching or LIGA technologies. To confirm our theories we characterize a number of different structures to determine an efficient layout in the end. For the validation of the cooling performances thermal transient tests.
Készítették: Gy. Bognár, G. Nagy, B. Plesz, P. G. Szabó, G. Takács